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With 1y and 1z nm 8Gb DDR4 production reportedly winding down, Samsung is said to be discontinuing its HBM2E products as well, as Commercial Times reveals they’ve reached the Last Buy Order (LBO) stage.
Though Samsung declined to confirm the information, this could imply its shift to more high-end products like HBM3E and HBM4, the report adds.
Samsung’s move to focus on next-gen HBM instead of legacy products seems reasonable, as Commercial Times reports that aggressive pricing from Chinese memory firms has already slashed average memory prices by over 60% between 2023 and 2024.
Notably, Commercial Times raises concerns about Chinese memory firms advancing in cutting-edge products as well, with 16nm DDR5 DRAM reportedly entering production. A previously Commercial Times report suggested that they are rumored to roll out HBM3 and HBM3e products around 2026-27.
As per Commercial Times, Samsung has notified its supply chain that 8GB LPDDR4 products based on 1y nm and 1z nm will reach end-of-life (EOL) by April 2025, with final orders (Last Buy Order, LBO) due by June. In addition, several 8GB and 16GB DDR4 SODIMM and UDIMM modules will be phased out, with final shipments scheduled for December 10, 2025, the report adds.
Samsung is certainly not the only memory giants initiating the change. Micron has reportedly informed customers it will discontinue legacy DDR4 modules for servers, while SK hynix is rumored to its DDR4 output, reducing its production share to 20%, Commercial Times indicates.
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(Photo credit: Samsung)
